Laser for image processing
In particular with PCB inspection or comparable applications in which the measured objects are very small, extremely high demands are placed on the projection quality. This application is mainly used for checking component presence and position as well as performing solder paste inspections. Very thin lines enable resolutions of less than 10 μm. With the simultaneously high peak power of the thin lines, the very high inspection speeds essential to mass production can be achieved.
Laser triangulation is a proven technique for rail inspection. Continuous quality inspections are required to keep track of the abrasion to the rail. Cracks, flacking, and chipping can lead to serious problems and major accidents.
A tire profile depth of at least 1.6 mm is compulsory in Germany. However at a 3 mm tire profile depth, the tire reaches an efficiency of only approx. 70%. Therefore, more and more garages are installing automatic measurement stations. This is based on a laser triangulation system which can measure the profile depth quickly, precisely and regardless of the lack of contrast, while the car drives past the 3D scanner.
Systems based on scattered light particle measurement are used in the qualification and quantification of particles, e.g., in clean rooms, medical facilities, and automotive exhaust gas measurement systems. In this application a defined amount of air or sample material is passed through a laser beam. The light scattering which is caused by organic or non-organic particles lead to conclusions regarding size and amand of such particles.
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